HexTrack
Technical Documentation
Table of contents
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Render Bottom
Schematic
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Assembly
Assembly document
Fabrication document
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ERC
- Errors: 0
- Warnings: 0
- Link: HTML Report
DRC
- Errors: 0
- Warnings: 1
- Link: HTML Report
PCB
Board size: 50.81x54.89 mm (2.0x2.16 inches)
- This is the size of the rectangle that contains the board
- Thickness: 1.6 mm (63 mils)
- Material: FR4
- Finish: ENIG
- Layers: 2
- Copper thickness: 35 µm
Solder mask: TOP / BOTTOM
- Color: Blue
Silk screen: TOP / BOTTOM
- Color: White
Special features:
- Edge connector: yes, bevelled
Stackup:
| Name | Type | Color | Thickness [µm] | Material | Er | Loss tan |
|---|---|---|---|---|---|---|
| F.SilkS | Top Silk Screen | White | ||||
| F.Paste | Top Solder Paste | |||||
| F.Mask | Top Solder Mask | Blue | 10 | |||
| F.Cu | copper | 35 | ||||
| dielectric 1 | core | FR4 natural | 1510 | FR4 | 4.5 | 0.020 |
| B.Cu | copper | 35 | ||||
| B.Mask | Bottom Solder Mask | Blue | 10 | |||
| B.Paste | Bottom Solder Paste | |||||
| B.SilkS | Bottom Silk Screen | White |
Important sizes
Clearance: 0.1 mm (4 mils)
Track width: 0.2 mm (8 mils)
- By design rules: 0.0 mm (0 mils)
Drill: 0.3 mm (12 mils)
- Vias: 0.3 mm (12 mils) [Design: 0.25 mm (10 mils)]
- Pads: 0.6 mm (24 mils)
- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)
Via: 0.4/0.2 mm (16/8 mils)
- By design rules: 0.3/0.15 mm (12/6 mils)
- Micro via: yes [0.2/0.1 mm (8/4 mils)]
- Buried/blind via: yes
- Total: 70 (thru: 70 buried/blind: 0 micro: 0)
Outer Annular Ring: 0.05 mm (2 mils)
- By design rules: 0.1 mm (4 mils)
Eurocircuits class: 10D
- Using min drill 0.3 mm for an OAR of 0.05 mm
General stats
Components count: (SMD/THT)
- Top: 32/1 (SMD + THT)
- Bottom: 0/1 (THT)
Defined tracks:
Used tracks:
- 0.2 mm (8 mils) (162) defined: no
- 0.4 mm (16 mils) (36) defined: no
Defined vias:
Used vias:
- 0.4/0.2 mm (16/8 mils) (Count: 4, Aspect: 4.0 A) defined: no
- 0.6/0.3 mm (24/12 mils) (Count: 66, Aspect: 2.7 A) defined: no
Holes (excluding vias):
- 0.5 mm (20 mils) (24)
- 0.7 mm (28 mils) (16)
- 3.2 mm (126 mils) (3)
Oval holes:
- 0.6x1.4 mm (24x55 mils) (2)
- 0.6x1.8 mm (24x71 mils) (2)
Drill tools (including vias and computing adjusts and rounding):
- 0.3 mm (12 mils) (4)
- 0.4 mm (16 mils) (66)
- 0.6 mm (24 mils) (24)
- 0.7 mm (28 mils) (4)
- 0.8 mm (31 mils) (16)
- 3.3 mm (130 mils) (3)
Solder paste stats:
Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³ and 1.0 g/cm³ for the flux. This paste has an specific gravity of 4.15 g/cm³.
The stencil thickness is 0.12 mm.
| Side | Pads with paste | Area [mm²] | Paste [g] |
|---|---|---|---|
| Total | 161 | 74.71 | 0.37 |
Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren’t computed.